Q1: What is the TLVS-H1.1 series used for?
A: The TLVS-H1.1 is a Visible–SWIR telecentric lens series designed for semiconductor inspection, IC imaging, silicon transmission analysis, and multi-spectral machine vision applications.
Q2: What is focus shift correction in this lens?
A: Focus shift correction allows the lens to maintain consistent focus across 400–1200nm wavelengths, eliminating the need to refocus when switching between visible and SWIR imaging.
Q3: Can this lens capture internal structures through silicon?
A: Yes. At around 1100nm transmission wavelength, the lens can image internal IC circuits and structures through silicon wafers.
Q4: What magnification options are available?
A: The series supports 0.7X, 1.0X, 2.0X, and 4.0X magnifications, suitable for different inspection and measurement requirements.
Q5: What is the advantage of a telecentric design?
A: Telecentric optics ensure low distortion, stable magnification, and high measurement accuracy, which is essential for precision inspection.
Q6: Does the lens support both coaxial and non-coaxial setups?
A: Yes, the TLVS-H1.1 series is available in coaxial and non-coaxial versions, depending on the application environment.
Q7: What industries commonly use this lens?
A: It is widely used in semiconductor manufacturing, IC inspection, electronics production, precision metrology, and advanced machine vision systems.
Q8: What is the wavelength range of this lens?
A: The lens operates across a wide 400–1200nm spectral range, covering both visible and SWIR imaging.
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Descripción
Product Description
Visible–SWIR Telecentric Lens with Focus Shift Correction for Precision Imaging
The TLVS-H1.1 Series is a high-performance Visible–SWIR telecentric lens designed for advanced machine vision applications requiring imaging across a wide wavelength range from 400 to 1200nm. Its unique focus shift correction technology ensures consistent image focus from visible light to shortwave infrared (SWIR), eliminating the need for refocusing during multi-spectrum inspection.
This series enables users to capture both visible and transmitted SWIR images with high stability, allowing the detection of internal structures and defects that are invisible under standard visible-light imaging. It is particularly effective for silicon wafer inspection and IC internal circuit imaging at ~1100nm transmission wavelength.
Available in 0.7X, 1.0X, 2.0X, and 4.0X magnifications, the TLVS-H1.1 series supports both coaxial and non-coaxial configurations, providing flexible integration for different industrial inspection systems.
Key Features
✔ Visible–SWIR Wideband Imaging (400–1200nm)
Supports seamless imaging from visible light to SWIR spectrum.
✔ Focus Shift Correction Technology
Maintains sharp focus across multiple wavelengths without adjustment.
✔ Telecentric Optical Design
Ensures distortion-free imaging and high measurement accuracy.
✔ Multi-Magnification Options (0.7X–4.0X)
Flexible configurations for various machine vision applications.
✔ IC Silicon Transmission Imaging (~1100nm)
Enables internal circuit inspection through silicon wafers.
✔ Coaxial / Non-Coaxial Versions Available
Suitable for reflective and transmissive inspection systems.
Ideal Applications
- Semiconductor Wafer Inspection
- IC Internal Circuit Imaging
- Silicon Transmission Inspection
- Electronics Manufacturing
- Defect Detection Across Spectra
- Precision Metrology
- Advanced Machine Vision Systems
- Multi-Spectral Industrial Imaging
Specifications
400-1200nm VIS-SWIR C-Mount Telecentric Lens
| Model | Mag. | WD | Image Circle | Coaxial |
|---|---|---|---|---|
| TLVS-0.7XD-H1.1 | 0.7X | 110 mm | Φ20.5 mm | Yes |
| TLVS-0.7X-H1.1 | 0.7X | 110 mm | Φ20.5 mm | No |
| TLVS-1.0XD-H1.1 | 1.0X | 110 mm | Φ24 mm | Yes |
| TLVS-1.0X-H1.1 | 1.0X | 110 mm | Φ24 mm | No |
| TLVS-2.0XD-H1.1 | 2.0X | 110 mm | Φ24 mm | Yes |
| TLVS-2.0X-H1.1 | 2.0X | 110 mm | Φ24 mm | No |
| TLVS-4.0XD-H1.1 | 4.0X | 110 mm | Φ20.5 mm | Yes |
| TLVS-4.0X-H1.1 | 4.0X | 110 mm | Φ20.5 mm | No |
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