Q1: What is the TLVS-H1.1 series used for?
A: The TLVS-H1.1 is a Visible–SWIR telecentric lens series designed for semiconductor inspection, IC imaging, silicon transmission analysis, and multi-spectral machine vision applications.
Q2: What is focus shift correction in this lens?
A: Focus shift correction allows the lens to maintain consistent focus across 400–1200nm wavelengths, eliminating the need to refocus when switching between visible and SWIR imaging.
Q3: Can this lens capture internal structures through silicon?
A: Yes. At around 1100nm transmission wavelength, the lens can image internal IC circuits and structures through silicon wafers.
Q4: What magnification options are available?
A: The series supports 0.7X, 1.0X, 2.0X, and 4.0X magnifications, suitable for different inspection and measurement requirements.
Q5: What is the advantage of a telecentric design?
A: Telecentric optics ensure low distortion, stable magnification, and high measurement accuracy, which is essential for precision inspection.
Q6: Does the lens support both coaxial and non-coaxial setups?
A: Yes, the TLVS-H1.1 series is available in coaxial and non-coaxial versions, depending on the application environment.
Q7: What industries commonly use this lens?
A: It is widely used in semiconductor manufacturing, IC inspection, electronics production, precision metrology, and advanced machine vision systems.
Q8: What is the wavelength range of this lens?
A: The lens operates across a wide 400–1200nm spectral range, covering both visible and SWIR imaging.
Estimated Delivery Time
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Descrizione
Descrizione del prodotto
Obiettivo telecentrico Visible–SWIR con correzione dello spostamento della messa a fuoco per imaging di precisione
La serie TLVS-H1.1 è un obiettivo telecentrico Visible–SWIR ad alte prestazioni progettato per applicazioni avanzate di machine vision che richiedono imaging su un ampio intervallo di lunghezze d'onda da 400 a 1200nm. La sua tecnologia unica di correzione dello spostamento della messa a fuoco garantisce una messa a fuoco dell'immagine costante dalla luce visibile all'infrarosso a onde corte (SWIR), eliminando la necessità di rimettere a fuoco durante l'ispezione multispettrale.
Questa serie consente agli utenti di acquisire immagini sia visibili che SWIR trasmesse con alta stabilità, permettendo la rilevazione di strutture interne e difetti invisibili con l'imaging standard a luce visibile. È particolarmente efficace per l'ispezione di wafer di silicio e l'imaging dei circuiti interni dei IC alla lunghezza d'onda di trasmissione di ~1100nm.
Disponibile in ingrandimenti 0.7X, 1.0X, 2.0X e 4.0X, la serie TLVS-H1.1 supporta sia configurazioni coassiali che non coassiali, offrendo un'integrazione flessibile per diversi sistemi di ispezione industriale.
Caratteristiche principali
✔ Imaging a banda larga Visible–SWIR (400–1200nm)
Supporta imaging continuo dalla luce visibile allo spettro SWIR.
✔ Tecnologia di correzione dello spostamento della messa a fuoco
Mantiene una messa a fuoco nitida su più lunghezze d'onda senza regolazioni.
✔ Design ottico telecentrico
Garantisce imaging senza distorsioni e alta accuratezza di misura.
✔ Opzioni di ingrandimento multipli (0.7X–4.0X)
Configurazioni flessibili per varie applicazioni di machine vision.
✔ Imaging di trasmissione del silicio per IC (~1100nm)
Consente l'ispezione dei circuiti interni attraverso wafer di silicio.
✔ Versioni coassiali / non coassiali disponibili
Adatto per sistemi di ispezione riflettente e trasmissivo.
Applicazioni ideali
- Ispezione di wafer semiconduttori
- Imaging dei circuiti interni dei IC
- Ispezione di trasmissione del silicio
- Produzione elettronica
- Rilevamento di difetti su più spettri
- Metrologia di precisione
- Sistemi avanzati di machine vision
- Imaging industriale multispettrale
Specifiche
Obiettivo telecentrico C-Mount VIS-SWIR 400-1200nm
| Modello | Ing. | WD | Cerchio immagine | Coassiale |
|---|---|---|---|---|
| TLVS-0.7XD-H1.1 | 0.7X | 110 mm | Φ20.5 mm | Sì |
| TLVS-0.7X-H1.1 | 0.7X | 110 mm | Φ20.5 mm | No |
| TLVS-1.0XD-H1.1 | 1.0X | 110 mm | Φ24 mm | Sì |
| TLVS-1.0X-H1.1 | 1.0X | 110 mm | Φ24 mm | No |
| TLVS-2.0XD-H1.1 | 2.0X | 110 mm | Φ24 mm | Sì |
| TLVS-2.0X-H1.1 | 2.0X | 110 mm | Φ24 mm | No |
| TLVS-4.0XD-H1.1 | 4.0X | 110 mm | Φ20.5 mm | Sì |
| TLVS-4.0X-H1.1 | 4.0X | 110 mm | Φ20.5 mm | No |
Download Obiettivo SWIR
Return and Exchange Policy
Please review our return and exchange policy carefully before placing your order. We encourage all customers to confirm product specifications and application requirements before purchase.
1. Return and Exchange Eligibility
Contrastech accepts return or exchange requests only for product defects or quality issues, subject to review and confirmation.
Returns or exchanges for reasons unrelated to product defects or quality issues are generally not accepted, subject to applicable law.
2. Non-Eligible Return and Exchange Requests
Before placing an order, customers are responsible for confirming that the selected product meets their technical requirements and is suitable for their intended application. Customers are also responsible for evaluating product compatibility with their systems and use cases.
Requests based on the following reasons are generally not eligible:
- Misunderstanding product specifications or selecting the wrong product.
- Product incompatibility with the customer's intended application.
- Personal dissatisfaction unrelated to a confirmed product defect or quality issue.
These limitations are subject to any mandatory rights or remedies available under applicable law.
3. Product Quality and Claim Period
Our products undergo quality control and quality assurance inspections before shipment. However, if a product you receive is damaged, defective, or materially inconsistent with its published description, please contact us within 3 business days of receipt to report the issue.
Important: Please provide your order number, a description of the issue, and relevant photos or videos where available. This information helps our team assess your claim efficiently.
Our team will review the information provided and advise you on the next steps. Please do not return any product before receiving return instructions from our team.
The stated reporting period does not limit any non-waivable rights you may have under applicable law.
4. Refund Processing and Transaction Fees
For return or refund requests that meet our eligibility requirements, we will process the refund within 1 business day after approval.
Please note that a 6.4% transaction processing fee charged by the payment platform is non-refundable and may be deducted from the refund amount, where permitted by applicable law and the relevant payment provider's terms.
The actual time required for the refunded amount to appear in your account may vary depending on your payment provider or bank.
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