CONTRASTECH | SEMICONDUCTOR IMAGING
Industrial Cameras for Semiconductor Inspection
From micro-defect detection to high-speed process analysis: choosing the right imaging technology for wafer inspection and advanced packaging.
As semiconductor devices become smaller and manufacturing processes more demanding, imaging systems must reveal fine defects, inspect complex structures, and capture fast-moving events. Different inspection stages call for different camera technologies. Here are four practical approaches from CONTRASTECH.
QUICK SELECTION GUIDE
Fine details? High-resolution area scan · Low-contrast features? UV imaging · Continuous scanning? 256-stage TDI · Fast events? Ultra-high-speed imaging
01 / MICRO-DEFECT INSPECTION
High-Resolution Area Scan Cameras
For wafer surfaces, microstructures, and advanced packaging, high pixel counts help capture fine details across large fields of view. CONTRASTECH's 12–245 MP area scan options support detailed imaging for precision inspection and metrology.
Applications: Wafer surface inspection · TGV inspection · Advanced packaging · Micro-defect detection
02 / UV SURFACE IMAGING
UV Area Scan Camera: iBt-194UVX8
Some surface features offer limited contrast under visible light. With suitable UV illumination and optics, UV imaging can help highlight selected surface residues, coatings, and material differences.
iBt-194UVX8: 2848 × 2848 (8.1 MP) · up to 193 FPS · 2.74 μm pixels · dual CXP-10 interfaces.
Applications: Wafer surface inspection · Photoresist residue imaging · Thin-film inspection
Explore UV Area Scan Cameras →03 / CONTINUOUS WAFER SCANNING
256-Stage TDI Line Scan Cameras
For moving wafers and large-area inspection, Time Delay Integration (TDI) accumulates signals across synchronized stages, increasing signal collection while supporting continuous scanning.
Featured models: iBt-M8KT256 (8K) and iBt-M16KT256 (16K), both offering 256-stage TDI technology and CoaXPress connectivity.
Applications: Continuous wafer scanning · Large-area inspection · Fine-defect detection on moving substrates
Explore Line Scan Cameras →04 / PROCESS MOTION ANALYSIS
Ultra-High-Speed Cameras
Wafer handling, die bonding, and wire bonding can involve events too fast for standard imaging systems. High-speed cameras help engineers observe motion, diagnose process failures, and optimize equipment operation.
Applications: Wafer handling and robotics · Die/wire bonding · Process failure analysis
Beyond the Camera: Complete Imaging Solutions
Reliable semiconductor inspection also depends on suitable optics, lighting, interfaces, and system integration. CONTRASTECH supports camera selection, machine vision lenses, industrial lighting, and OEM/ODM configurations for specialized inspection systems.
The right combination depends on defect size, field of view, required throughput, target material, and illumination conditions.
Find the Right Camera for Your Inspection System
Tell us about your wafer inspection or process-analysis requirements. Our team can help identify a suitable camera, lens, and lighting combination.
Contact CONTRASTECH →